HAIHONG® Low Temperature Solder able (LTS) copper coating has successfully made it possible for the high power LED package to directly be soldered onto heat sinks made from aluminum. HAIHONG® Low Temperature Solder able (LTS) copper coating technique is the ideal solution to the degradation of heat conduction performance of thermal interface material (TIM) between integrated chip LED package and heat sink. The using of integrated chip LED package is benefit to design LED lighting at its very best optical performance.

COPETITIVE ADVANTAGES:

   A thin copper coating is strongly bonded to the soldering required area on the surface of aluminum heat sinks;

   The contact thermal resistance is eliminated through the soldering of high power LED package directly onto aluminum heat sinks;

   The heat conductivity of lead-free soldering material (~50W/m.K) is 10 times higher than that (~5W/m.K) of the best thermal interface material (TIM);

   The alloying combination of dissimilar materials between copper and aluminum prevents rebinding from thermal stress and chemical corrosion;

   The enhanced heat transfer from direct soldering can significantly reduce required heat dissipation area of aluminum heat sinks for the desired LED operation temperature